COPPER BONDED ELECTRODE
SALIENT FEATURES
- Made from Low Carbon High Quality Mild Steel Pipes (ISI Marked)
- Permanent Molecular Bonding of 99.9% Pure Electrolytic Copper
- Copper Bonding (100 Microns+ (Minimum) | 254 Microns+)
- Excellent Conductivity, Low Resistance Guaranteed
- Cost-Effective in Comparison to Pure Copper Electrodes
- Larger Surface Area for Higher Fault Current Dissipation
- Maintenance Free and Corrosion Resistant (Rust Proof)
- Aesthetic and Unique Design
- Long Service Life
- Easy & Fast Installation
- Moisture Booster Chemical Bag provided for Low Earth Resistance
- Available along with Test Certificate
WHY LATH ?
- 10 YEARS REPLACEMENT AND PERFORMANCE GUARANTEE*
- Minimum Wall Thickness 3mm for Outer Diameter (OD) 48mm and 3.6mm for OD >76mm
- Made using only ADOR or ESAB MIG Welding & its Consumables
- Minimum 100 Microns+ Copper Bonding prevents Rusting and Corrosion
- Full Inner Strip, Size same as Top Terminal (Can be Cut & Checked)
- Bottom Welded Inner Strip (Visible at Bottom)
- Highly Conductive Compound Filled instead of Cheaper Spurious Materials
- All our Products are Laser Marked as a Testimonial of Performance & Guarantee
PRODUCT SPECIFICATION
TESTS PASSED
IN-HOUSE LABORATORY
- Wall Thickness of Pipe (Minimum 3mm)
- Adhesion Test (Knife Test) No Peel Off
- Copper Bonding Thickness Test (Minimum 100 microns+ | 254 microns+)